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FODM214 - onsemi

Description: Current Transfer Ratio Ranges from 20 to 400% at IF = ±1mA, VCE = 5 V, TA = 25ºC - FODM214 - 20 to 400% - FODM214A - 50 to 250%; Safety and Regulatory Approvals: - UL1577, 3750 VACRMS for 1 min - DIN EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage; Applicable to Infrared Ray Reflow, 260ºC

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FODM214 - onsemi - PCB symbol
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PCB Footprints
FODM214 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MFP4 2.5X4.4
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3D Models
FODM214 - onsemi - 3D model - Small Outline Packages - MFP4 2.5X4.4
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FODM214 Details

  • Manufacturer Part Number:

    FODM214

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    SOP-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    20%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM214 Frequently Asked Questions (FAQs)

  • The FODM214 can operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • The FODM214 requires a bias voltage of 5V to 30V, and the recommended bias current is 10mA to 20mA. Ensure the bias voltage is stable and within the recommended range for optimal performance.
  • A good PCB layout should provide a solid ground plane, minimize trace lengths, and use thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • Handle the FODM214 with ESD-safe materials, use an ESD wrist strap or mat, and ensure the PCB has ESD protection components such as TVS diodes or resistors.
  • The typical response time of the FODM214 is around 10μs to 20μs, but this can vary depending on the specific application and operating conditions.

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FODM214 Overview

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