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FODM214A - onsemi

Description: Current Transfer Ratio Ranges from 20 to 400% at IF = ±1mA, VCE = 5 V, TA = 25ºC - FODM214 - 20 to 400% - FODM214A - 50 to 250%; Safety and Regulatory Approvals: - UL1577, 3750 VACRMS for 1 min - DIN EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage; Applicable to Infrared Ray Reflow, 260ºC

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FODM214A - onsemi - PCB symbol
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FODM214A - onsemi PCB footprint - Other - Other - FODM214A-2
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FODM214A Details

  • Manufacturer Part Number:

    FODM214A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    SOP-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM214A Frequently Asked Questions (FAQs)

  • The FODM214A can operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • The FODM214A requires a bias voltage of 5V to 24V, and the recommended bias current is 1mA to 10mA. Ensure the bias voltage is stable and noise-free for optimal performance.
  • Keep the PCB layout as compact as possible, with a minimum spacing of 0.5mm between the FODM214A and other components. Use a ground plane to reduce noise and ensure good thermal dissipation.
  • The FODM214A has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • The typical response time for the FODM214A is around 10μs, but this can vary depending on the specific application and operating conditions.

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FODM214A Overview

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