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FODM217AR2 - onsemi

Description: Applicable to Infrared Ray Reflow, 260ºC; Current Transfer Ratio Ranges from 80 to 600% at IF = 5 mA, VCE = 5 V, TA = 25ºC -FODM217A - 80 to 160% - FODM217B - 130 to 260% - FODM217C - 200 to 400% - FODM217D - 300 to 600%; Safety and Regulatory Approvals: - UL1577, 3750 VACRMS for 1 min - DIN EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage

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FODM217AR2 - onsemi - PCB symbol
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FODM217AR2 Details

  • Manufacturer Part Number:

    FODM217AR2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    SOP-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    80%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM217AR2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FODM217AR2 is -40°C to 125°C.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. Also, ensure that the input voltage (VIN) is within the recommended range of 4.5V to 5.5V.
  • To minimize EMI and noise, use a multi-layer PCB with a solid ground plane, and keep the FODM217AR2 away from high-frequency signals. Use short, direct traces for the input and output signals, and avoid routing signals under the device.
  • Yes, the FODM217AR2 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to automotive and industrial standards, including AEC-Q100 and IEC 60747-5-5.
  • During power-up, the FODM217AR2's output is undefined until the input voltage (VIN) reaches the minimum operating voltage (VCC). During power-down, the output will remain valid until VIN falls below the minimum operating voltage. Ensure that the system design takes these sequences into account to avoid unwanted behavior.

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FODM217AR2 Overview

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