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FODM2701R2 - onsemi

Description: More than 5mm Creepage/Clearance; Compact 4-Pin Surface Mount Package (2.4mm Maximum Standoff Height); Current Transfer Ratio in Selected Groups DC Input: FODM121: 50–600% FODM121A: 100–300% FODM121B: 50–150% FODM121C: 100–200% FODM124: 100% MIN FODM2701: 50–300% AC Input: FODM2705: 50–300%; Safety and Regulatory Approvals: ♦ UL1577, 3,750 VACRMS for 1 Minute ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

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FODM2701R2 - onsemi - PCB symbol
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FODM2701R2 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MFP4 3.85X4.4, 2.54P CASE 100AP ISSUE O
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FODM2701R2 - onsemi - 3D model - Small Outline Packages - MFP4 3.85X4.4, 2.54P CASE 100AP ISSUE O
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FODM2701R2 Details

  • Manufacturer Part Number:

    FODM2701R2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Manufacturer Package Code:

    100AP

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.08 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM2701R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for FODM2701R2 involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to VCC or a digital signal for enable/disable functionality. The input pins (IN+ and IN-) should be biased to a voltage within the recommended common-mode range.
  • The maximum allowable capacitive load for the FODM2701R2 is 100 pF. Exceeding this limit may affect the device's stability and performance.
  • The FODM2701R2 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The recommended operating temperature range for the FODM2701R2 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

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FODM2701R2 Overview

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