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FODM2705 - onsemi

Description: More than 5mm Creepage/Clearance; Compact 4-Pin Surface Mount Package (2.4mm Maximum Standoff Height); Current Transfer Ratio in Selected Groups DC Input: FODM121: 50–600% FODM121A: 100–300% FODM121B: 50–150% FODM121C: 100–200% FODM124: 100% MIN FODM2701: 50–300% AC Input: FODM2705: 50–300%; Safety and Regulatory Approvals: ♦ UL1577, 3,750 VACRMS for 1 Minute ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

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Symbol
FODM2705 - onsemi - PCB symbol
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PCB Footprints
FODM2705 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - FODM124R2
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3D Models
FODM2705 - onsemi - 3D model - Small Outline Packages - FODM124R2
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FODM2705 Details

  • Manufacturer Part Number:

    FODM2705

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Manufacturer Package Code:

    100AP

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.08 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM2705 Frequently Asked Questions (FAQs)

  • A good PCB layout for FODM2705 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to a logic high (VCC) to enable the device. The input pins (IN+ and IN-) should be biased to a voltage within the recommended common-mode range.
  • The maximum allowable power dissipation for FODM2705 is 250mW. It's essential to ensure the device operates within this limit to prevent overheating and damage.
  • To prevent ESD damage, handle the FODM2705 by the body or pins, avoid touching the pins, and use an anti-static wrist strap or mat. Store the device in an anti-static bag or tube when not in use.
  • The recommended operating temperature range for FODM2705 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

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FODM2705 Overview

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