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FODM2705R2V - onsemi

Description: More than 5mm Creepage/Clearance; Compact 4-Pin Surface Mount Package (2.4mm Maximum Standoff Height); Current Transfer Ratio in Selected Groups DC Input: FODM121: 50–600% FODM121A: 100–300% FODM121B: 50–150% FODM121C: 100–200% FODM124: 100% MIN FODM2701: 50–300% AC Input: FODM2705: 50–300%; Safety and Regulatory Approvals: ♦ UL1577, 3,750 VACRMS for 1 Minute ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

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FODM2705R2V Details

  • Manufacturer Part Number:

    FODM2705R2V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Manufacturer Package Code:

    100AP

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.08 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM2705R2V Frequently Asked Questions (FAQs)

  • A good PCB layout for the FODM2705R2V should minimize parasitic inductance and capacitance. Keep the input and output traces short and wide, and use a solid ground plane to reduce noise. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure proper biasing, connect the EN pin to a logic high (VCC) to enable the device. The VCC pin should be connected to a stable voltage source between 2.5V and 5.5V. The VIN pin should be connected to a voltage source that meets the recommended input voltage range (2.5V to 5.5V).
  • The maximum allowable power dissipation for the FODM2705R2V is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 1.4W at an ambient temperature of 25°C. However, this value can be derated based on the actual operating conditions.
  • The FODM2705R2V is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure proper thermal management and derate the power dissipation accordingly to prevent overheating.
  • To troubleshoot issues with the FODM2705R2V, start by verifying the input voltage, output voltage, and current consumption using a multimeter or an oscilloscope. Check the PCB layout for any signs of damage, overheating, or poor soldering. Ensure that the device is properly biased and that the input and output capacitors are of the correct value and type. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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FODM2705R2V Overview

Use the download button to access the FODM2705R2V 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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