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FODM8801AR2 - onsemi

Description: Utilizing proprietary process technology to achieve high operating temperature up to 125°C; Compact half pitch, mini-flat, 4-pin package (1.27mm lead pitch, 2.4mm maximum standoff height); > 5mm creepage and clearance distance; High isolation voltage regulated by safety agency, UL1577, 3750 VAC RMS for 1 min. and DIN EN/IEC60747-5-2 (pending approval); Applicable to Infrared Ray reflow, 245°C; Guaranteed Current Transfer Ratio (CTR) specifications across full temperature range; CTR at very low input current

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FODM8801AR2 - onsemi - PCB symbol
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FODM8801AR2 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MFPA 4L
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FODM8801AR2 Details

  • Manufacturer Part Number:

    FODM8801AR2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    MINIFLAT-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    75 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    35%

  • Current Transfer Ratio-Nom:

    138%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.02 A

  • Forward Voltage-Max:

    1.8 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.00002 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

FODM8801AR2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and avoid crossing them over each other.
  • The FODM8801AR2 requires a bias voltage of 5V on the VCC pin and a bias current of 10mA on the IBIAS pin. Ensure the bias voltage and current are stable and within the recommended operating range.
  • The maximum allowable power dissipation for the FODM8801AR2 is 1.5W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended operating range.
  • Use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. Handle the device by the body or use an anti-static wrist strap to prevent ESD damage.
  • The FODM8801AR2 is designed to operate from DC to 1GHz. However, the optimal operating frequency range is from 100MHz to 500MHz for best performance and lowest distortion.

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FODM8801AR2 Overview

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