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FPF1321UCX - onsemi

Description: Quick Discharge Feature on FPF1321

Download FPF1321UCX Model
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PCB Footprints
FPF1321UCX - onsemi PCB footprint - BGA - BGA - 6-Ball, 1.0 x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP)
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3D Models
FPF1321UCX - onsemi  - 3D model - BGA - 6-Ball, 1.0 x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP)
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FPF1321UCX Details

  • Manufacturer Part Number:

    FPF1321UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567RM

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.12

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.46 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

FPF1321UCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the VIN pin is 24V. Exceeding this voltage may damage the device. Ensure that the input voltage is within the recommended range (4.5V to 24V) for reliable operation.
  • Use a TVS (transient voltage suppressor) or a voltage clamp to protect the device from voltage spikes and transients. Also, ensure that the input voltage is within the recommended range and the device is operated within its specified power handling capabilities.
  • A 10uF to 22uF ceramic or X5R/X7R dielectric capacitor is recommended for input decoupling. This helps to filter out noise and ensure stable operation.

Trust Checks

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FPF1321UCX Overview

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