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FPF2195 - onsemi

Description: 5µs to Moderate Over Currents ; Fast Current Limit Response Time ; Under-Voltage Lockout ; <1.8 to 5.5V Input Voltage Range ; Auto Restart ; Thermal Shutdown ; 30ns to Hard Shorts ; Fault Blanking ; 0.1 to 1.5A Adjustable Current Limit ; Reverse Current Blocking; Controlled Turn-On ; <2µA Shutdown Current

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PCB Footprints
FPF2195 - onsemi PCB footprint - BGA - BGA - 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
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3D Models
FPF2195 - onsemi  - 3D model - BGA - 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
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FPF2195 Details

  • Manufacturer Part Number:

    FPF2195

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567RN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.03

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

FPF2195 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FPF2195 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To optimize the FPF2195 for low power consumption, ensure that the input voltage is as low as possible, use a high-efficiency inductor, and minimize the output voltage ripple. Additionally, consider using a low-power mode or shutdown feature if available.
  • The maximum ambient temperature range for the FPF2195 is -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures, so it's essential to ensure proper thermal management and heat sinking.
  • Yes, the FPF2195 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard for automotive-grade devices and is designed to operate in harsh environments.
  • To troubleshoot issues with the FPF2195, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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FPF2195 Overview

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