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FPF2496UCX - onsemi

Description: Logic CMOS IO Meets JESD76 Standard for GPIO Interface and Related Power Supply Requirements; Output Discharge During Off State; Open-Drain OVP on FLAGB; VIN: 3.5 V~5.5 V; Thermal Shutdown; Adjustable Current Limit: (Typ.) 0.1 A~2.5 A with 10% Accuracy ; True Reverse-Current Blocking (TRCB); Input OVP: Min.=5.6 V, Typ.=5.8 V, Max.=6 V; RON: Maximum 100 mΩ at 5 VIN and 1 A IOUT; Current Capability: 2.5 A; 28 V Absolute Ratings at VIN; Under-Voltage Lockout (UVLO)

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PCB Footprints
FPF2496UCX - onsemi PCB footprint - BGA - BGA - FPF2496
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FPF2496UCX - onsemi  - 3D model - BGA - FPF2496
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FPF2496UCX Details

  • Manufacturer Part Number:

    FPF2496UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-9

  • Package Description:

    WLCSP-9

  • Manufacturer Package Code:

    567RV

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Additional Feature:

    ALSO OPERATES WITH SUPPLY VOLTAGE 2.5 TO 5.5V

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.21 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.21 mm

FPF2496UCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Monitor the input voltage, output voltage, and current to ensure they are within the specified ranges. Also, ensure the device is operated within the recommended temperature range (-40°C to 125°C).
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7 μF to 10 μF is recommended for the input capacitor.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke or ferrite bead to filter the output.
  • The maximum allowed output capacitance is 220 μF. Exceeding this value may cause instability or oscillations.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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FPF2496UCX Overview

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