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FPF2700MPX - onsemi

Description: ON SEMICONDUCTOR - FPF2700MPX - SWITCH, LOAD, 0.4-2.0A, 8MLP

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PCB Footprints
FPF2700MPX - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead, 3x3 mm Molded Leadless Package
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3D Models
FPF2700MPX - onsemi  - 3D model - Small Outline No-lead - 8-Lead, 3x3 mm Molded Leadless Package
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FPF2700MPX Details

  • Manufacturer Part Number:

    FPF2700MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MLP-8

  • Manufacturer Package Code:

    511DD

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    0.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

FPF2700MPX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Use a high-quality output capacitor with low ESR (Equivalent Series Resistance) and a minimum capacitance of 10uF. Additionally, ensure the input capacitor is properly sized and placed close to the device.
  • The maximum input voltage is 26V, but it's recommended to operate within 20V to ensure reliable operation and minimize the risk of damage.
  • The FPF2700MPX is rated for operation up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • The output voltage can be adjusted by using a resistive divider network between the output and the FB (feedback) pin. The ratio of the resistors determines the output voltage, which can be calculated using the formula provided in the datasheet.

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