Part Image

FPF2700MX - onsemi

Description: IC, Fairchild, FPF2700MX

Download FPF2700MX Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FPF2700MX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD, SOIC, JDEC MS-012, 0.150" NARROW BODY+
click to zoom
3D Models
FPF2700MX - onsemi  - 3D model - Small Outline Packages - 8-LEAD, SOIC, JDEC MS-012, 0.150" NARROW BODY+
click to zoom

FPF2700MX Details

  • Manufacturer Part Number:

    FPF2700MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    0.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FPF2700MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate correctly. Ensure VIN is within the recommended range (2.7V to 5.5V) and VBIAS is set to 1.2V to 1.8V.
  • The maximum current rating for the FPF2700MX is 2A. However, it's recommended to operate the device within the recommended operating current range (0.5A to 1.5A) for optimal performance and reliability.
  • The FPF2700MX requires a specific power sequencing to prevent damage. Ensure that VIN is applied before VBIAS, and VBIAS is removed before VIN during power-down.
  • The FPF2700MX has a maximum junction temperature (TJ) of 150°C. Ensure proper thermal design and heat dissipation to prevent overheating, which can affect device performance and reliability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FPF2700MX Overview

Use the download button to access the FPF2700MX schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FPF27, or try a keyword search, such as Peripheral Drivers

Parts related to FPF2700MX

Showing 0 results

FPF2700MX Alternates

Showing results

Image Part Number Model
Part Image FPF2700MX Fairchild Semiconductor Corporation

Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.4A, PDSO8