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FPF2895CUCX - onsemi

Description: 28V / 5A Capability; Wide Input Voltage Range: 4V ~ 22V; Ultra Low On-Resistance; Typ. 27 mΩ at 5V and 25 °C; Adjustable Current Limit with external RSET: - 500 mA ~ 5 A; Selectable OVLO with OV1 and OV2 Logic Input: - 5.95 V ± 50 mV - 10 V ± 100 mV - 16.8 V ± 300 mV - 23 V ± 460 mV; Selectable ON Polarity; Selectable Over-Current Behavior: - Auto-Restart Mode - Current Source Mode; True Reverse Current Block; Thermal Shutdown

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Symbol
FPF2895CUCX - onsemi - PCB symbol
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PCB Footprints
FPF2895CUCX - onsemi PCB footprint - BGA - BGA - 24-Ball, 0.4 mm Pitch WLCSP
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3D Models
FPF2895CUCX - onsemi - 3D model - BGA - 24-Ball, 0.4 mm Pitch WLCSP
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FPF2895CUCX Details

  • Manufacturer Part Number:

    FPF2895CUCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-24

  • Package Description:

    WLCSP-24

  • Manufacturer Package Code:

    567TQ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.22

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B24

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA24,4X6,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.612 mm

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.67 mm

FPF2895CUCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal pad connected to a solid ground plane.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power dissipation at high temperatures.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke to reduce EMI. Also, ensure that the PCB layout is optimized for minimal radiation.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

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FPF2895CUCX Overview

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