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FQPF6N90C - onsemi

Description: Low Crss ( Typ. 11pF); 100% avalanche tested; 6A, 900V, RDS(on) = 2.3Ω(Max.) @VGS = 10 V, ID = 3A; Low gate charge ( Typ. 30nC)

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FQPF6N90C - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - FQPF6N90C
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FQPF6N90C - onsemi  - 3D model - Transistor Outline, Vertical - FQPF6N90C
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FQPF6N90C Details

  • Manufacturer Part Number:

    FQPF6N90C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3 FullPak

  • Package Description:

    TO-220F, 3 PIN

  • Manufacturer Package Code:

    221AT

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    650 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    2.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    56 W

  • Pulsed Drain Current-Max (IDM):

    24 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FQPF6N90C Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the FQPF6N90C is not explicitly stated in the datasheet, but it can be determined by consulting the onsemi application note AND8193/D, which provides guidelines for calculating the SOA for power MOSFETs.
  • To ensure proper thermal management, it is recommended to follow the thermal design guidelines outlined in the onsemi application note AND8194/D, which provides guidance on thermal interface materials, heat sink selection, and thermal resistance calculations.
  • The recommended gate drive voltage for the FQPF6N90C is between 10V and 15V, as specified in the datasheet. However, the optimal gate drive voltage may vary depending on the specific application and switching frequency.
  • Yes, the FQPF6N90C can be used in high-frequency switching applications, but it is essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the gate drive circuitry is designed to minimize ringing and oscillations.
  • The internal diode of the FQPF6N90C can be handled by using a diode clamp circuit or a snubber circuit to prevent voltage spikes and ringing during switching. The specific implementation will depend on the application and switching frequency.

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FQPF6N90C Overview

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