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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for FR1003GP-TP
- Part Number FR1003GP-TP
- Manufacturer MCC
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
FR1003GP-TP Details
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Manufacturer Part Number:
FR1003GP-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Not Recommended
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Micro Commercial Components
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YTEOL:
3
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Additional Feature:
LOW LEAKAGE CURRENT
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Application:
FAST RECOVERY
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Breakdown Voltage-Min:
200 V
FR1003GP-TP Frequently Asked Questions (FAQs)
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The recommended land pattern for FR1003GP-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
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The thermal pad of FR1003GP-TP should be connected to a copper plane on the PCB to dissipate heat efficiently. It's recommended to use a thermal interface material (TIM) between the thermal pad and the copper plane to reduce thermal resistance.
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The maximum operating temperature range for FR1003GP-TP is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
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Yes, FR1003GP-TP is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to follow proper PCB design and assembly guidelines to ensure the device's reliability in high-vibration environments.
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To ensure the reliability of FR1003GP-TP in high-humidity environments, it's recommended to follow proper PCB design and assembly guidelines, including the use of moisture-resistant materials and conformal coating. Additionally, the device should be stored in a dry environment before assembly and soldering.
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FR1003GP-TP Overview
Use the download button to access the FR1003GP-TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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