The recommended land pattern for FR1004GP-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
Yes, FR1004GP-TP is compatible with lead-free soldering. It has a peak reflow temperature of 260°C, which is suitable for lead-free soldering processes.
The MSL of FR1004GP-TP is 3, which means it can withstand a maximum exposure of 168 hours at 30°C and 60% relative humidity before soldering.
Yes, FR1004GP-TP can be used in high-temperature applications up to 150°C. However, it's recommended to derate the power rating accordingly to ensure reliable operation.
Yes, FR1004GP-TP is RoHS and REACH compliant, making it suitable for use in EU and other regions that require these compliances.
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FR1004GP-TP Overview
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