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FR1004GP-TP - MCC

Description: Diode 400 V 10A Through Hole R-6

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PCB Footprints
FR1004GP-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - R-6-1
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3D Models
FR1004GP-TP - MCC  - 3D model - Diodes, Axial Diameter Horizontal Mounting - R-6-1
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FR1004GP-TP Details

  • Manufacturer Part Number:

    FR1004GP-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.02

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    400 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.15 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

FR1004GP-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for FR1004GP-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
  • Yes, FR1004GP-TP is compatible with lead-free soldering. It has a peak reflow temperature of 260°C, which is suitable for lead-free soldering processes.
  • The MSL of FR1004GP-TP is 3, which means it can withstand a maximum exposure of 168 hours at 30°C and 60% relative humidity before soldering.
  • Yes, FR1004GP-TP can be used in high-temperature applications up to 150°C. However, it's recommended to derate the power rating accordingly to ensure reliable operation.
  • Yes, FR1004GP-TP is RoHS and REACH compliant, making it suitable for use in EU and other regions that require these compliances.

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FR1004GP-TP Overview

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