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FS32K116LAT0MFMT - NXP

Description: NXP - FS32K116LAT0MFMT - MCU, AEC-Q100, 32BIT, 48MHZ, QFN

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FS32K116LAT0MFMT - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x
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FS32K116LAT0MFMT - NXP  - 3D model - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for FS32K116LAT0MFMT
  • Part Number FS32K116LAT0MFMT
  • Manufacturer NXP
  • Pin Count 33
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x
  • Released Date Oct 28, 2019
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

FS32K116LAT0MFMT Details

  • Manufacturer Part Number:

    FS32K116LAT0MFMT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    28

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    32

  • Number of Timers:

    18

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    17408

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Screening Level:

    ISO 26262

  • Seated Height-Max:

    0.85 mm

  • Speed:

    48 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

FS32K116LAT0MFMT Frequently Asked Questions (FAQs)

  • NXP recommends using a 12MHz crystal oscillator with a load capacitance of 18pF and a series resistance of 500 ohms for optimal performance.
  • To optimize power consumption in low-power modes, use the STOP or VLPS modes, and consider using the VLLS0 or VLLS1 modes for even lower power consumption. Also, disable peripherals and clocks when not in use.
  • The maximum frequency for the internal clock source is 32 kHz. However, the device can operate up to 48 MHz using an external clock source.
  • Implement secure boot mechanisms by using the device's built-in boot ROM and configuring the flash configuration field to enable secure boot. Additionally, use encryption and digital signatures to ensure the authenticity of the firmware.
  • Thermal management considerations include ensuring good airflow, using a heat sink if necessary, and avoiding high-temperature storage or operation. The device's junction temperature should not exceed 150°C.

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FS32K116LAT0MFMT Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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