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FS32V234CON1VUB - NXP

Description: MPU RISC 32bit/64bit 1GHz Automotive 621-Pin FCBGA Tray

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PCB Footprints
FS32V234CON1VUB - NXP PCB footprint - BGA - BGA - 17/17 bga
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3D Models
FS32V234CON1VUB - NXP  - 3D model - BGA - 17/17 bga
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FS32V234CON1VUB Details

  • Manufacturer Part Number:

    FS32V234CON1VUB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FCBGA-621

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bit Size:

    64

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B621

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of External Interrupts:

    1

  • Number of Terminals:

    621

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA621,25X25,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    4194304

  • Seated Height-Max:

    2.44 mm

  • Speed:

    1000 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

FS32V234CON1VUB Frequently Asked Questions (FAQs)

  • NXP recommends a 4-layer PCB with a solid ground plane and thermal vias to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the top layer.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the specified temperature range (–40°C to 125°C).
  • Use a minimum of 2 x 10uF ceramic capacitors (X7R or X5R dielectric) with a voltage rating of 10V or higher, placed as close as possible to the power pins. Add additional capacitors (e.g., 1uF, 0.1uF) for further noise reduction.
  • Implement power-saving modes, such as dynamic voltage and frequency scaling, and use the device's low-power modes (e.g., sleep, standby). Optimize software to minimize CPU usage and leverage the device's power management features.
  • Implement ESD protection diodes (e.g., 1.5KE6.8A) on all external interfaces, and ensure the PCB design includes a solid ground plane and ESD-protective components (e.g., TVS diodes).

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FS32V234CON1VUB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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