FS400R12A2T4 footprint, schematic symbol and 3D model by Infineon

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FS400R12A2T4 Details

Manufacturer Part Number:
FS400R12A2T4
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
ECCN Code:
EAR99
Manufacturer:
Infineon Technologies AG
YTEOL:
0
Case Connection:
ISOLATED
Collector Current-Max (IC):
400 A
Collector-Emitter Voltage-Max:
1200 V
Configuration:
3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
JESD-30 Code:
R-XUFM-X24
Number of Elements:
6
Number of Terminals:
24
Operating Temperature-Max:
175 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
N-CHANNEL
Surface Mount:
NO
Terminal Form:
UNSPECIFIED
Terminal Position:
UPPER
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
POWER CONTROL
Transistor Element Material:
SILICON
Turn-off Time-Nom (toff):
700 ns
Turn-on Time-Nom (ton):
250 ns

The maximum allowed voltage imbalance is ±10% of the nominal DC-link voltage. Exceeding this limit may affect the module's reliability and performance.
Ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce thermal resistance. The maximum allowed junction temperature is 150°C.
The recommended gate resistance is between 10 Ω and 20 Ω. A lower gate resistance can improve switching speed, but may increase power losses.
Yes, the module can be used in a parallel configuration, but ensure that the modules are properly synchronized and that the current sharing is balanced to avoid uneven stress on the modules.
The maximum allowed dv/dt is 10 kV/μs. Exceeding this limit may cause the module to malfunction or fail.

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