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FS450R17OE4P - Infineon

Description: IGBT Modules 1700 V, 450 A sixpack IGBT module

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FS450R17OE4P - Infineon  - 3D model
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FS450R17OE4P Details

  • Manufacturer Part Number:

    FS450R17OE4P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

  • Gate-Emitter Thr Voltage-Max:

    6.4 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X29

  • Number of Elements:

    6

  • Number of Terminals:

    29

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1010 ns

  • Turn-on Time-Nom (ton):

    310 ns

  • VCEsat-Max:

    2.3 V

FS450R17OE4P Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-03) that outlines the recommended PCB layout and thermal design guidelines for the FS450R17OE4P. It's essential to follow these guidelines to ensure optimal performance, thermal management, and reliability.
  • Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the FS450R17OE4P's gate-source voltage (VGS). The driver should also have a low propagation delay and a high common-mode transient immunity (CMTI) to ensure reliable operation.
  • Operating the FS450R17OE4P at high temperatures can lead to reduced performance, increased power losses, and decreased reliability. It's essential to ensure proper thermal management, such as using a heat sink and thermal interface material, to keep the junction temperature (Tj) within the recommended range (≤150°C).
  • To protect the FS450R17OE4P, it's recommended to use a combination of overvoltage protection (OVP) and overcurrent protection (OCP) circuits. These can be implemented using external components, such as TVS diodes and current sense resistors, or by using a dedicated protection IC.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), it's essential to follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as needed.

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FS450R17OE4P Overview

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