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FS45MR12W1M1_B11 - Infineon

Description: modulewithCoolSiC™TrenchMOSFETandPressFIT/NTC

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FS45MR12W1M1_B11 - Infineon - PCB symbol
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PCB Footprints
FS45MR12W1M1_B11 - Infineon PCB footprint - Other - Other - FS45MR12W1M1_B11-5
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FS45MR12W1M1_B11 - Infineon - 3D model - Other - FS45MR12W1M1_B11-5
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FS45MR12W1M1_B11 Details

  • Manufacturer Part Number:

    FS45MR12W1M1_B11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MODULE-22

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • DS Breakdown Voltage-Min:

    1200 V

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    14 pF

  • JESD-30 Code:

    R-XUFM-X22

  • Number of Elements:

    6

  • Number of Terminals:

    22

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

FS45MR12W1M1_B11 Frequently Asked Questions (FAQs)

  • The thermal resistance (Rth) of the FS45MR12W1M1_B11 is typically around 1.5 K/W (junction to case) and 3.5 K/W (junction to ambient) at a maximum junction temperature of 150°C.
  • Yes, the FS45MR12W1M1_B11 is designed for high-reliability applications, such as automotive and industrial systems, and meets the requirements of AEC-Q101 and IATF 16949 standards.
  • To ensure proper cooling, follow the recommended PCB layout and thermal design guidelines provided by Infineon. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The maximum allowed voltage for the FS45MR12W1M1_B11 is 12 V, with a maximum voltage tolerance of ±10%.
  • The FS45MR12W1M1_B11 is designed for high-frequency applications up to 1 MHz, but it's essential to consider the device's switching characteristics, layout, and PCB design to minimize parasitic effects.

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FS45MR12W1M1_B11 Overview

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