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FS75R06KE3 - Infineon

Description: IGBT Modules IGBT-MODULES 600V

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PCB Footprints
FS75R06KE3 - Infineon PCB footprint - Other - Other - FS75R06KE3-2
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3D Models
FS75R06KE3 - Infineon  - 3D model - Other - FS75R06KE3-2
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FS75R06KE3 Details

  • Manufacturer Part Number:

    FS75R06KE3

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    28

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Qualification Status:

    Not Qualified

FS75R06KE3 Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) for the FS75R06KE3 is 175°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum power loss of the device, and the TIM should have a low thermal resistance.
  • The recommended gate drive voltage for the FS75R06KE3 is between 10V and 15V. However, the optimal gate drive voltage may vary depending on the specific application and switching frequency.
  • Yes, the FS75R06KE3 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate drive requirements, and thermal management when designing the application.
  • To protect the FS75R06KE3 from overvoltage and overcurrent, it's recommended to use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) mechanism. These can be implemented using external components or integrated into the device's driver circuitry.

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