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FSA1153UCX - onsemi

Description: 1 Circuit IC Switch 3:1 2Ohm 12-WLCSP (1.41x1.575)

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FSA1153UCX - onsemi PCB footprint - BGA - BGA - WLCSP12, 1.41x1.575x0.599 CASE 567WM ISSUE O
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FSA1153UCX - onsemi  - 3D model - BGA - WLCSP12, 1.41x1.575x0.599 CASE 567WM ISSUE O
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FSA1153UCX Details

  • Manufacturer Part Number:

    FSA1153UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    WLCSP-12

  • Package Description:

    VFBGA-12

  • Manufacturer Package Code:

    567WM

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-12-19

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.575 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Off-state Isolation-Nom:

    65 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    2 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.637 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.41 mm

FSA1153UCX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA1153UCX involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, make sure to connect the EN pin to a logic high (VCC) and the FB pin to the output voltage divider. Also, ensure that the input voltage is within the recommended range (4.5V to 18V) and that the output voltage is set correctly using the resistor divider.
  • The FSA1153UCX can deliver up to 3A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. It's recommended to check the thermal derating curves in the datasheet to ensure the device can handle the required output current.
  • To protect the FSA1153UCX from overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor IC to monitor the input voltage and shut down the device if it exceeds the recommended range. Additionally, use a TVS diode or a zener diode to clamp the input voltage to a safe level.
  • The recommended input capacitor value is 10uF to 22uF, and it should be a low-ESR ceramic capacitor (X5R or X7R dielectric) with a voltage rating of at least 25V. This helps to filter out input noise and ensure stable operation.

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