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FSA1156L6X - onsemi

Description: FSA1156L6X ON Semiconductor, Multiplexer Switch IC Single SPST, 1.65 → 5.5 V, 6-Pin MicroPak

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PCB Footprints
FSA1156L6X - onsemi PCB footprint - Other - Other - SIP6 1.45X1.0 CASE 127EB ISSUE O
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FSA1156L6X - onsemi  - 3D model - Other - SIP6 1.45X1.0 CASE 127EB ISSUE O
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FSA1156L6X Details

  • Manufacturer Part Number:

    FSA1156L6X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VSON-6

  • Manufacturer Package Code:

    127EB

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • On-state Resistance Match-Nom:

    0.6 Ω

  • On-state Resistance-Max (Ron):

    2.1 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Signal Current-Max:

    0.2 A

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    35 ns

  • Switch-on Time-Max:

    40 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

FSA1156L6X Frequently Asked Questions (FAQs)

  • A good PCB layout for FSA1156L6X involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common mode choke or a ferrite bead to filter out high-frequency noise.
  • To ensure proper biasing, make sure to connect the EN pin to a stable voltage source, and the VIN pin to a voltage source that meets the recommended operating range. Also, ensure that the input voltage is within the specified range and that the output voltage is properly regulated.
  • FSA1156L6X has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device near its maximum temperature rating. Also, follow the recommended PCB layout and thermal design guidelines.
  • To troubleshoot issues with FSA1156L6X, start by checking the input voltage, output voltage, and current. Verify that the device is properly biased and that the input voltage is within the recommended range. Check for any signs of overheating, and ensure that the device is properly cooled. If issues persist, consult the datasheet and application notes for guidance.
  • Yes, FSA1156L6X is susceptible to electromagnetic interference (EMI). To ensure EMI/EMC compliance, follow proper PCB layout and design guidelines, use shielding and filtering techniques, and ensure that the device is properly grounded. Additionally, consult the datasheet and application notes for specific EMI/EMC guidelines.

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