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FSA2567UMX - onsemi

Description: 3kV ESD Rating, >12kV Power/GND ESD Rating; Low On Resistance for Data Path: 6Ω Typical ; Packaged in: ; Low On Capacitance for Data Path: 10pF Typical ; Wide -3db Bandwidth: > 160MHz ; Low Power Quiescent Consumption: 1µA Maximum ; Pb-free 16-Lead UMLP (1.8 x 2.6mm) ; Pb-free 16-Lead MLP ; Low On Resistance for Supply Path 0.4Ω Typical ; 15µA Maximum ICCT Over Expanded Voltage Range (VIN=1.8V, VCC=4.3V)

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PCB Footprints
FSA2567UMX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead Ultrathin Molded Leadless Package (UMLP)
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3D Models
FSA2567UMX - onsemi  - 3D model - Quad Flat No-Lead - 16-Lead Ultrathin Molded Leadless Package (UMLP)
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FSA2567UMX Details

  • Manufacturer Part Number:

    FSA2567UMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UQFN-16

  • Package Description:

    UMLP-16

  • Manufacturer Package Code:

    523BF

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.28

  • Analog IC - Other Type:

    4PDT

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.07X.1,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    50 ns

  • Switch-on Time-Max:

    95 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

FSA2567UMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA2567UMX involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and decouple it with a 0.1uF capacitor to ground. The EN pin should be tied to VCC or a digital signal for enable/disable control. The VIN pin should be connected to a stable input voltage.
  • The FSA2567UMX can handle input voltages up to 5.5V, but it's recommended to keep the input voltage below 5V to ensure optimal performance and prevent damage to the device.
  • To troubleshoot issues with the FSA2567UMX, check the power supply voltage, ensure proper decoupling, and verify the input signal integrity. Use an oscilloscope to check the output waveform and verify that it meets the expected specifications.
  • The FSA2567UMX is rated for operation up to 85°C, but it's recommended to keep the operating temperature below 70°C for optimal performance and reliability. Ensure proper thermal design and heat dissipation to prevent overheating.

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