Part Image

FSA515UCX - onsemi

Description: SPST Depletion Switch; Normally Closed when VCC<0.5V; VSW: -3V to +5.5V; RON: 0.7Ω (Typical); RFLAT: 1.1mΩ (Typical)

Download FSA515UCX Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FSA515UCX - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.815x0.815x0.457
click to zoom
3D Models
FSA515UCX - onsemi  - 3D model - BGA - WLCSP4, 0.815x0.815x0.457
click to zoom

FSA515UCX Details

  • Manufacturer Part Number:

    FSA515UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567VT

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2018-12-20

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.815 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Off-state Isolation-Nom:

    97 dB

  • On-state Resistance Match-Nom:

    0.0011 Ω

  • On-state Resistance-Max (Ron):

    1.1 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.495 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.815 mm

FSA515UCX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heatsinked and the current rating is not exceeded. The device can handle high currents, but thermal management is crucial.
  • Check the input voltage, output voltage, and enable pin voltage. Verify the PCB layout and thermal design. Consult the datasheet and application notes for guidance.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FSA515UCX Overview

Use the download button to access the FSA515UCX schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FSA51, or try a keyword search, such as Multiplexers or Switches

Parts related to FSA515UCX

Showing 0 results