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FSA553UCX - onsemi

Description: Dual SPST Depletion Switch; Normally Closed when VCC < 0.2 V; Switches Configurable through Select Pins; VSW: -1.5 V to +1.5 V; RON: 0.4 Ώ (Typical); RFLAT < 0.01 Ώ (Typical); THD+N: -104 dB (Typical); OIRR: -78 dB (Typical)

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Symbol
FSA553UCX - onsemi - PCB symbol
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PCB Footprints
FSA553UCX - onsemi PCB footprint - BGA - BGA - 9-Ball WLCSP
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3D Models
FSA553UCX - onsemi - 3D model - BGA - 9-Ball WLCSP
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FSA553UCX Details

  • Manufacturer Part Number:

    FSA553UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-9

  • Package Description:

    WLCSP-9

  • Manufacturer Package Code:

    567SV

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PBGA-B9

  • Length:

    1.38 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Off-state Isolation-Nom:

    82 dB

  • On-state Resistance Match-Nom:

    0.01 Ω

  • On-state Resistance-Max (Ron):

    0.8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.619 mm

  • Supply Voltage-Max (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.21 mm

FSA553UCX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA553UCX involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to VCC or a logic high signal to enable the device. The BYP pin should be connected to a 0.1uF capacitor to ground for proper bypassing.
  • The maximum current rating of the FSA553UCX is 500mA per channel. However, it's recommended to derate the current to 300mA per channel for optimal performance and reliability.
  • To protect the FSA553UCX from ESD and overvoltage, use TVS diodes or ESD protection devices on the input and output lines. Additionally, use a voltage regulator to regulate the input voltage to 5V, and consider adding a fuse or PTC resettable fuse to protect against overcurrent.
  • The recommended operating temperature range for the FSA553UCX is -40°C to 85°C. However, the device can operate up to 125°C with reduced performance and reliability.

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FSA553UCX Overview

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