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FSA660TMX - onsemi

Description: MIPI Switch IC 1 Channel 18-TMLP (2x2.8)

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Symbol
FSA660TMX - onsemi - PCB symbol
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PCB Footprints
FSA660TMX - onsemi PCB footprint - Other - Other - 18-TMLP (2x2.8)
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3D Models
FSA660TMX - onsemi - 3D model - Other - 18-TMLP (2x2.8)
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FSA660TMX Details

  • Manufacturer Part Number:

    FSA660TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2QFN-18

  • Package Description:

    TMLP-18

  • Manufacturer Package Code:

    722AB

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-09

  • Manufacturer:

    onsemi

  • YTEOL:

    6.59

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-XQCC-N18

  • Length:

    2.8 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Off-state Isolation-Nom:

    28 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    300 ns

  • Switch-on Time-Max:

    600 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Silver/Gold/Palladium (Ni/Ag/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

FSA660TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA660TMX involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and connect the VEE pin to a stable -5V or -3.3V power supply. The VREF pin should be connected to a stable voltage reference, and the EN pin should be tied to a logic high or low depending on the desired enable state.
  • The FSA660TMX can support data rates up to 6 Gbps, but the actual achievable data rate depends on the specific application, PCB layout, and signal integrity.
  • The FSA660TMX has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or thermal pad, and ensure good airflow around the device. Avoid blocking the airflow around the device, and use thermal interface materials with high thermal conductivity.
  • The FSA660TMX has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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FSA660TMX Overview

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