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FSAM30SH60A - onsemi

Description: OBSOLETE Power Supply IC; IPM Power Device:IGBT; Voltage Rating (Vces / Vdss):600V; Current Rating (Ic / Id):30A; Isolation Voltage:2.5kV; IPM Case Style:DIP; IPM Series:SPM2; Product Range:-; Filter Terminals:Screw; Frequency:15kHz RoHS Compliant: Yes

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Symbol
FSAM30SH60A - onsemi - PCB symbol
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PCB Footprints
FSAM30SH60A - onsemi PCB footprint - Other - Other - S32AA-032
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3D Models
FSAM30SH60A - onsemi - 3D model - Other - S32AA-032
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FSAM30SH60A Details

  • Manufacturer Part Number:

    FSAM30SH60A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    S32AA-032 / 32LD, PDD STD, CERAMIC DIP TYPE

  • Package Description:

    Module-32

  • Manufacturer Package Code:

    MODDV

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T32

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Output Current-Max:

    60 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,32LEAD,1.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

FSAM30SH60A Frequently Asked Questions (FAQs)

  • The maximum junction temperature of the FSAM30SH60A is 150°C. It's essential to ensure that the device operates within this temperature range to prevent damage or malfunction.
  • To calculate the power dissipation of the FSAM30SH60A, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance. The power dissipation (Pd) can be calculated using the formula: Pd = (Voltage Drop x Current) / (1 - (RθJA x Power Factor)).
  • For optimal performance and thermal management, it's recommended to use a multi-layer PCB with a solid ground plane, and to place the FSAM30SH60A near a heat sink or a thermal pad. Ensure that the PCB layout minimizes thermal resistance and provides adequate heat dissipation.
  • Yes, the FSAM30SH60A is suitable for high-reliability applications. It's manufactured using a robust process, and onsemi provides a high level of quality control and testing to ensure the device meets stringent reliability standards.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and avoid applying excessive heat or mechanical stress during the soldering process.

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FSAM30SH60A Overview

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FSAM30SH60A Alternates

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Part Image FSAM30SH60A Fairchild Semiconductor Corporation

AC Motor Controller, 60A, Hybrid, DMA32