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FSB50250BS - onsemi

Description: UL Certified No. E209204 (UL1557); Optimized for over 10 kHz Switching Frequency; 500 V FRFET MOSFET 3-Phase Inverter with Gate Drivers and Protection; Built-In Bootstrap Diodes Simplify PCB Layout; Separate Open-Source Pins from Low-Side MOSFETs for Three-Phase Current-Sensing; Active-HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt-trigger Input; Optimized for Low Electromagnetic Interference; HVIC Temperature-Sensing Built-In for Temperature Monitoring; HVIC for Gate Driving and Under-Voltage Protecti

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FSB50250BS - onsemi PCB footprint - Other - Other - FSB50250BS-3
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FSB50250BS Details

  • Manufacturer Part Number:

    FSB50250BS

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SMD-023

  • Package Description:

    SPM-5Q, 23 PIN

  • Manufacturer Package Code:

    MODEM

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-G23

  • JESD-609 Code:

    e3

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.6 mm

  • Supply Current-Max (Isup):

    0.9 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

FSB50250BS Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering techniques.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • When selecting an input capacitor for the FSB50250BS, consider the voltage rating, capacitance value, and ESR (Equivalent Series Resistance). A general rule of thumb is to choose a capacitor with a voltage rating at least 1.5 times the maximum input voltage, and a capacitance value between 1-10 μF. The ESR should be as low as possible to minimize energy losses.
  • Not using a bootstrap capacitor in the circuit can lead to reduced performance, increased power losses, and potentially even device failure. The bootstrap capacitor helps to maintain the high-side driver voltage, ensuring proper operation of the device. Omitting it can cause the high-side driver to malfunction or fail.

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FSB50250BS Overview

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