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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for FSBB30CH60D
- Part Number FSBB30CH60D
- Manufacturer onsemi
- Pin Count 27
- Last Modified Date Mar 30, 2026 11:41 AM UTC
- Pinout / Pin List Click Here (Member Only)
FSBB30CH60D Details
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Manufacturer Part Number:
FSBB30CH60D
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
DIP-027
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Package Description:
MODULE-27
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Manufacturer Package Code:
MODFJ
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Factory Lead Time:
4 Weeks
FSBB30CH60D Frequently Asked Questions (FAQs)
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The maximum junction temperature of the FSBB30CH60D is 150°C. It's essential to ensure that the device operates within this temperature range to prevent damage or degradation.
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The thermal resistance of the FSBB30CH60D can be calculated using the thermal resistance values provided in the datasheet. The junction-to-case thermal resistance (RθJC) is 1.5°C/W, and the case-to-ambient thermal resistance (RθCA) is dependent on the specific heat sink and cooling system used. You can use the following formula: RθJA = RθJC + RθCA.
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The recommended gate drive voltage for the FSBB30CH60D is between 10V and 15V. This ensures proper switching and minimizes the risk of damage to the device.
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Yes, the FSBB30CH60D is suitable for high-frequency switching applications. However, it's essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the gate drive circuitry is designed to accommodate the high-frequency operation.
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To protect the FSBB30CH60D from overvoltage and overcurrent, you can use a combination of voltage regulators, overvoltage protection (OVP) circuits, and current sensing and limiting circuits. Additionally, ensure that the device is operated within its specified voltage and current ratings.
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FSBB30CH60D Overview
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