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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for FSBB30CH60DF
- Part Number FSBB30CH60DF
- Manufacturer onsemi
- Pin Count 27
- Part Category Integrated Circuit
- Last Modified Date Jun 18, 2026 7:40 AM UTC
- Pinout / Pin List Click Here (Member Only)
FSBB30CH60DF Details
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Manufacturer Part Number:
FSBB30CH60DF
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
DIP-027
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Package Description:
MODULE-27
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Manufacturer Package Code:
MODFJ
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Factory Lead Time:
54 Weeks
FSBB30CH60DF Frequently Asked Questions (FAQs)
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The maximum junction temperature of the FSBB30CH60DF is 150°C. It's essential to ensure that the device operates within this temperature range to prevent damage or degradation.
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To calculate the power dissipation of the FSBB30CH60DF, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance. The power dissipation (Pd) can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
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To minimize EMI, it's recommended to follow a good PCB layout practice, such as keeping the high-frequency components away from the low-frequency components, using a solid ground plane, and minimizing the loop area of the high-frequency circuits. Additionally, it's recommended to use a shielded inductor and to place the FSBB30CH60DF close to the input capacitors.
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Yes, the FSBB30CH60DF is a high-reliability device that meets the requirements of the automotive and aerospace industries. It's qualified to the AEC-Q101 standard, which ensures that it meets the stringent reliability and quality requirements of these industries.
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To ensure proper cooling, it's essential to provide adequate heat sinking and airflow around the device. The FSBB30CH60DF has a thermal pad on the bottom of the package, which should be connected to a heat sink or a thermal interface material to dissipate heat efficiently. Additionally, ensure that the device is mounted on a PCB with good thermal conductivity and that there is adequate airflow around the device.
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FSBB30CH60DF Overview
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