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FSL538APG - onsemi

Description: Rugged 800V FET with 3.8 Ω Typ.RDS(on) with Built-in HV current source for start up; Fine-tunable Skip Mode Operation; Integrated Line Compensation; Line Brown-in, Brown-out Function; Line Over-voltage Protection (LOVP); Fsw options: 100 & 130 kHz; Seamless implementation of isolated and non-isolated topologies; Peak Current: FSL538A = 860mA and FSL538H = 660 mA

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FSL538APG - onsemi  - 3D model
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FSL538APG Details

  • Manufacturer Part Number:

    FSL538APG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP-7

  • Package Description:

    DIP-8/7

  • Manufacturer Package Code:

    626A-01

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDIP-T7

  • JESD-609 Code:

    e3

  • Length:

    9.59 mm

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.93 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7/8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Seated Height-Max:

    5.33 mm

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    NO

  • Switching Frequency-Max:

    106 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

FSL538APG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the package, and using a thermal pad on the bottom of the package. Additionally, keeping the PCB traces away from the package and using a heat sink can help to improve thermal performance.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, using a heat sink, ensuring good airflow, and avoiding thermal hotspots can help to prevent overheating. It is also crucial to follow the recommended soldering and assembly procedures to prevent damage to the device.
  • Key considerations for EMI and RFI mitigation when using the FSL538APG include using a shielded enclosure, keeping the PCB layout compact, using a common-mode choke, and adding EMI filters to the input and output lines. Additionally, using a low-pass filter on the output and a ferrite bead on the input can help to reduce EMI and RFI emissions.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, ensure that the enable pin is properly biased, and verify that the output voltage is within the specified range. Also, check for any signs of overheating, such as excessive temperature or thermal shutdown. If the issue persists, consult the application note and the datasheet for further guidance.
  • Using a different input capacitor value than recommended can affect the stability and performance of the device. A larger input capacitor can increase the startup time and reduce the noise immunity, while a smaller input capacitor can cause oscillations and reduce the output voltage regulation. It is essential to follow the recommended input capacitor value to ensure reliable operation and optimal performance.

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FSL538APG Overview

Use the download button to access the FSL538APG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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