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FSM15PL-TP - MCC

Description: Diode 400 V 1A Surface Mount SOD-123FL

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Symbol
FSM15PL-TP - MCC - PCB symbol
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PCB Footprints
FSM15PL-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL 1e4t5
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3D Models
FSM15PL-TP - MCC - 3D model - Small Outline Diode Flat Lead - SOD-123FL 1e4t5
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FSM15PL-TP Details

  • Manufacturer Part Number:

    FSM15PL-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.25 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

FSM15PL-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad under the package, using a minimum of 2 oz copper thickness, and ensuring a solid ground plane on the bottom layer. Additionally, it's recommended to use vias to connect the thermal pad to the ground plane.
  • To ensure the device is properly biased, make sure to provide a stable voltage supply within the recommended operating range (1.8V to 5.5V). Also, ensure that the input signals are within the recommended voltage range (0V to VCC) and that the output is properly terminated to prevent signal reflections.
  • The maximum allowable power dissipation for the FSM15PL-TP is 1.5W. However, it's recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the PCB to ensure reliable operation.
  • Yes, the FSM15PL-TP is suitable for high-frequency applications up to 100 MHz. However, it's essential to consider the device's propagation delay, rise and fall times, and output impedance to ensure signal integrity and minimize signal distortion.
  • The FSM15PL-TP has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to further protect the device from electrostatic discharge.

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FSM15PL-TP Overview

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