The thermal resistance of the FSR03BE is not explicitly stated in the datasheet, but according to Ohmite's application notes, the thermal resistance from junction to case (RθJC) is approximately 1.5°C/W, and from case to ambient (RθCA) is approximately 10°C/W.
Yes, the FSR03BE is designed to withstand high-vibration environments. Ohmite's datasheet mentions that the device is suitable for use in applications with high mechanical stress, including vibration and shock.
Ohmite recommends a PCB layout that minimizes thermal resistance and ensures good heat dissipation. A recommended layout is to use a large copper pad under the device, with multiple vias to the bottom layer to dissipate heat. The datasheet provides a recommended PCB footprint and layout guidelines.
The FSR03BE is designed to operate in a wide range of environmental conditions, including high humidity. However, it's recommended to follow proper conformal coating and sealing procedures to ensure the device's reliability in humid environments.
The FSR03BE can withstand surge currents up to 100A for 10ms, according to Ohmite's application notes. However, it's recommended to consult with Ohmite's technical support for specific surge current requirements and to ensure the device is properly sized for the application.
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