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FSTD16211MTDX - onsemi

Description: Minimal propagation delay through the switch; 4ohm switch connection between two ports; Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA); Zero bounce in flow-through mode; Voltage level shifting; Low lCC; Control inputs compatible with TTL level

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PCB Footprints
FSTD16211MTDX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 56 LEAD TSSOP MO-153 6.1MM WIDE MTD56+
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FSTD16211MTDX - onsemi  - 3D model - Small Outline Packages - 56 LEAD TSSOP MO-153 6.1MM WIDE MTD56+
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FSTD16211MTDX Details

  • Manufacturer Part Number:

    FSTD16211MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-56

  • Package Description:

    TSSOP-56

  • Manufacturer Package Code:

    948BR

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

FSTD16211MTDX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures.
  • The maximum allowable voltage on the enable pin (EN) is 6V, which is higher than the recommended operating voltage of 3.3V or 5V to ensure compatibility with various logic levels.
  • Yes, the FSTD16211MTDX can be used as a high-side switch, but ensure the input voltage (VIN) is within the recommended operating range, and the output voltage (VOUT) is within the specified voltage range.
  • Use a shielded cable, keep the PCB layout compact, and ensure good grounding. Also, consider adding EMI filters or ferrite beads to the input and output lines.

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FSTD16211MTDX Overview

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Part Image FST16211MTDX Fairchild Semiconductor Corporation

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Part Image FSTUD16211MTDX Fairchild Semiconductor Corporation

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Part Image IDT74FST163211PAG Integrated Device Technology Inc

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Part Image IDT74FST163211PA8 Integrated Device Technology Inc

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For a full list of alternate parts for FSTD16211MTDX, check out Findchips.com