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FSV1045V - onsemi

Description: Halogen Free; RoHS Compliant; Low Thermal Resistance; Ultra-Low Forward Voltage Drop: - 0.41 V Typical at 10 A, TA = 25°C - 0.44 V Maximum at 10 A, TA = 25°C; Meets MSL 1 per JESD22-A111 Full-Body Solder Immersion; Very Low Profile: Typical Height of 1.1 mm

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PCB Footprints
FSV1045V - onsemi PCB footprint - Other - Other - FSV1045V-1
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FSV1045V - onsemi  - 3D model - Other - FSV1045V-1
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FSV1045V Details

  • Manufacturer Part Number:

    FSV1045V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.32

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    45 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.44 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    220 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV1045V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FSV1045V, the maximum voltage is 45V and the maximum current is 10A. Operating within these limits ensures safe and reliable operation.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • A gate drive voltage of 10-15V is recommended for optimal switching performance. However, the optimal voltage may vary depending on the specific application and PCB layout.

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FSV1045V Overview

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