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FSV1060V - onsemi

Description: Low Thermal Resistance; Ultra-Low Forward Voltage Drop: - 0.47 V Typical at 10 A, TA = 25°C - 0.52 V Maximum at 10 A, TA = 25°C; RoHS Compliant; Halogen Free; Very Low Profile: Typical Height of 1.1 mm; Meets MSL 1 per JESD22-A111 Full-Body Solder Immersion

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PCB Footprints
FSV1060V - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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3D Models
FSV1060V - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV1060V Details

  • Manufacturer Part Number:

    FSV1060V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.52 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    280 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    220 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV1060V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the VIN pin is 18V, but it's recommended to keep it below 15V for optimal performance and reliability.
  • Yes, the FSV1060V is designed for high-reliability applications. However, it's essential to follow proper design and manufacturing guidelines to ensure the system meets the required reliability standards.
  • Use a systematic approach to troubleshoot issues. Check the power supply, input voltage, and output voltage. Use oscilloscopes and logic analyzers to debug the circuit. Consult the datasheet and application notes for guidance.

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FSV1060V Overview

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