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FSV15150V - onsemi

Description: Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Trench Schottky Technology; Low Thermal Resistance; RoHS Compliant; Ultra-Low Forward Voltage Drop; Very Low Profile: Typical Height of 1.1 mm; Green Molding Compound as per IEC61249 Standard

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FSV15150V - onsemi PCB footprint - Other - Other - FSV15150V-3
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FSV15150V - onsemi  - 3D model - Other - FSV15150V-3
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FSV15150V Details

  • Manufacturer Part Number:

    FSV15150V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Package Description:

    TO-277, 3 PIN

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    150 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV15150V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature protection, over-voltage protection, and over-current protection to prevent damage.
  • Yes, the FSV15150V is AEC-Q100 qualified and suitable for automotive and high-reliability applications. Ensure you follow the recommended design and testing guidelines for these applications.
  • Use a shielded enclosure, keep the device away from sensitive circuits, and implement EMI filters or chokes as needed. Follow good PCB layout practices, such as separating analog and digital grounds.

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FSV15150V Overview

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