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FSV20120V - onsemi

Description: Low Thermal Resistance; RoHS Compliant; Very Low Profile: Typical Height of 1.1 mm; Trench Schottky Technology; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Ultra-Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard

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PCB Footprints
FSV20120V - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV20120V - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV20120V Details

  • Manufacturer Part Number:

    FSV20120V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    120 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.79 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    270 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    35 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV20120V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FSV20120V, the SOA is limited by the maximum voltage rating (200V) and the maximum current rating (10A).
  • Yes, the FSV20120V can be used in switching applications. However, ensure that the device is properly driven and the switching frequency is within the recommended range to avoid overheating and reduce electromagnetic interference (EMI).
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB has ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from static electricity.

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FSV20120V Overview

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