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FSV2050V - onsemi

Description: Low Thermal Resistance; Very Low Profile: Typical Height of 1.1 mm; Qualified with Reflow (J-STD-020) and Solder Temperature 260°C Classification; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; RoHS Compliant; Ultra Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard

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PCB Footprints
FSV2050V - onsemi PCB footprint - Other - Other - FSV1045V-1
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3D Models
FSV2050V - onsemi  - 3D model - Other - FSV1045V-1
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FSV2050V Details

  • Manufacturer Part Number:

    FSV2050V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    50 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    320 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    320 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV2050V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FSV2050V, the SOA is limited by the maximum voltage rating (50V) and current rating (20A). Operating within these limits ensures safe and reliable operation.
  • Yes, the FSV2050V can be used in switching applications, but ensure that the device is properly driven and the switching frequency is within the recommended range (typically up to 100 kHz). Also, consider the device's switching losses and thermal performance.
  • Use a voltage regulator or overvoltage protection circuit to prevent voltage spikes. Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.

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FSV2050V Overview

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