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FSV560 - onsemi

Description: Low Thermal Resistance; RoHS Compliant; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Very Low Profile: Typical Height of 1.1 mm; Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard

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Symbol
FSV560 - onsemi - PCB symbol
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PCB Footprints
FSV560 - onsemi PCB footprint - Other - Other - FSV560-3
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3D Models
FSV560 - onsemi - 3D model - Other - FSV560-3
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FSV560 Details

  • Manufacturer Part Number:

    FSV560

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.67 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV560 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSV560 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the input capacitors. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive nodes can help minimize EMI.
  • The inductor value for the FSV560 depends on the input voltage, output voltage, and desired switching frequency. A good starting point is to use the inductor value calculation formula provided in the datasheet, and then adjust based on the specific design requirements and efficiency goals.
  • The FSV560 is rated for operation from -40°C to 150°C, but the maximum ambient temperature range depends on the specific application and cooling conditions. It's recommended to derate the device's power handling capability at higher temperatures to ensure reliable operation.
  • Yes, the FSV560 can be used in a synchronous rectification configuration to improve efficiency. However, this requires careful design and layout considerations to ensure proper operation and minimize losses.
  • To troubleshoot issues with the FSV560, start by checking the PCB layout, component values, and soldering quality. Verify that the input and output capacitors are properly sized and placed, and that the inductor is suitable for the application. If issues persist, consult the datasheet and application notes for guidance on debugging and troubleshooting techniques.

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FSV560 Overview

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