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FUSB301TMX - onsemi

Description: Dual Role Port Mode with Optional Accessory Support; Fully Autonomous Type-C Controller; 2 kV HBM ESD Protection; Dead Battery Support (Sink Mode Support when No Power Applied); Super Speed Switch Control; Low Standby Power: ICC = 7 µA (Max.); VDD Operating Range, 3.0 V- 5.5 V; Small Packaging, 10 Lead TMLP(1.6 mm x 1.2 mm x 0.375 mm); Low Disable Power: ICC = 2 µA (Max.); Supports Type-C Version 1.1 and 1.0; Capable of Supporting Try.SNK and Try.SRC

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PCB Footprints
FUSB301TMX - onsemi PCB footprint - Other - Other - FUSB301TMX-3
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3D Models
FUSB301TMX - onsemi  - 3D model - Other - FUSB301TMX-3
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FUSB301TMX Details

  • Manufacturer Part Number:

    FUSB301TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2QFN-10

  • Manufacturer Package Code:

    722AC

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    R-PQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

FUSB301TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for FUSB301TMX involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the USB traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The FUSB301TMX requires a 3.3V power supply, and the EN pin should be tied to VCC to enable the device. The device is configured through the I2C interface, and the configuration registers should be written to during power-up.
  • The FUSB301TMX has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid high ambient temperatures.
  • Use an oscilloscope to monitor the voltage and current waveforms, and check for any signs of oscillation or ringing. Verify that the input and output capacitors are properly sized and placed, and ensure that the device is properly configured and powered.
  • The FUSB301TMX is designed to meet EMI/EMC standards, but proper PCB layout, shielding, and filtering are still necessary. Ensure that the device is placed in a shielded enclosure, and use EMI filters and common-mode chokes as needed to meet regulatory standards such as FCC and CE.

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FUSB301TMX Overview

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