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FUSB302B11MPX - onsemi

Description: Ability to connect as either a host or a device based on what has been attached. ; Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Dead Battery Support (SNK Mode Support when No Power Applied); Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Automatic soft reset packet sent with retries if needed ; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Low Power Operation: ICC = 25 µA (Typical); Automatic

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FUSB302B11MPX - onsemi - PCB symbol
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PCB Footprints
FUSB302B11MPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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3D Models
FUSB302B11MPX - onsemi - 3D model - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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FUSB302B11MPX Details

  • Manufacturer Part Number:

    FUSB302B11MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-14

  • Package Description:

    MLP-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302B11MPX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FUSB302B11MPX involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the USB traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • The FUSB302B11MPX requires a single 3.3V power supply. Ensure that the power supply is stable and well-regulated. Power sequencing is not critical, but it is recommended to power up the device after the power supply has stabilized.
  • The FUSB302B11MPX has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments.
  • The FUSB302B11MPX is a USB 2.0 device, but it can be configured to operate in USB 3.2 Gen 1 mode by setting the MODE pin high. Consult the datasheet for specific configuration details.
  • The FUSB302B11MPX has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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FUSB302B11MPX Overview

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