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FUSB302BMPX - onsemi

Description: Ability to connect as either a host or a device based on what has been attached. ; Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Dead Battery Support (SNK Mode Support when No Power Applied); Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Automatic soft reset packet sent with retries if needed ; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Low Power Operation: ICC = 25 µA (Typical); Automatic

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PCB Footprints
FUSB302BMPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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3D Models
FUSB302BMPX - onsemi  - 3D model - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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FUSB302BMPX Details

  • Manufacturer Part Number:

    FUSB302BMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-14

  • Package Description:

    MLP-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302BMPX Frequently Asked Questions (FAQs)

  • A good PCB layout for FUSB302BMPX involves keeping the device close to the USB connector, using a solid ground plane, and minimizing the length of the D+/D- traces. It's also recommended to use a common mode filter and a shielded cable to reduce EMI.
  • To ensure compliance with USB 2.0 specifications, follow the guidelines outlined in the USB 2.0 specification document, and use the FUSB302BMPX in conjunction with a USB 2.0-compliant controller. Additionally, perform thorough testing to ensure that your design meets the required specifications.
  • FUSB302BMPX has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum current for extended periods. Monitor the device temperature and adjust the operating conditions accordingly.
  • Yes, FUSB302BMPX is designed to support high-speed USB applications up to 480 Mbps. However, ensure that your design meets the high-speed USB signal integrity requirements, and use a high-speed USB-compliant cable and connector.
  • To troubleshoot issues with FUSB302BMPX, start by verifying the device's power supply and clock signals. Check the USB signal quality using an oscilloscope, and ensure that the device is properly configured and enumerated. Consult the onsemi application notes and technical support resources for further guidance.

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FUSB302BMPX Overview

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