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FUSB302BUCX - onsemi

Description: Ability to connect as either a host or a device based on what has been attached. ; Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Dead Battery Support (SNK Mode Support when No Power Applied); Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Automatic soft reset packet sent with retries if needed ; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Low Power Operation: ICC = 25 µA (Typical); Automatic

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PCB Footprints
FUSB302BUCX - onsemi PCB footprint - BGA - BGA - WLCSP9 1.26x1.215x0.526 CASE 567TN ISSUE O
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3D Models
FUSB302BUCX - onsemi  - 3D model - BGA - WLCSP9 1.26x1.215x0.526 CASE 567TN ISSUE O
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FUSB302BUCX Details

  • Manufacturer Part Number:

    FUSB302BUCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-9

  • Package Description:

    WLCSP-9

  • Manufacturer Package Code:

    567TN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    R-XBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.26 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.526 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.215 mm

FUSB302BUCX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FUSB302BUCX involves keeping the device close to the USB connector, using a solid ground plane, and minimizing the length of the D+ and D- traces. It's also recommended to use a common mode filter and a shielded cable to reduce EMI.
  • The FUSB302BUCX is a highly configurable device. To ensure proper configuration, refer to the onsemi application note AN5223, which provides detailed guidance on configuring the device for various USB applications, including USB-C and Power Delivery.
  • The FUSB302BUCX has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the FUSB302BUCX, use a USB protocol analyzer to capture and analyze the USB traffic. Check the device's configuration and settings, and refer to the onsemi application notes and technical support resources for guidance.
  • Yes, when using the FUSB302BUCX in a USB-C or Power Delivery application, ensure that the device is configured correctly for the specific application, and follow the USB-C and Power Delivery specifications. Additionally, use a USB-C connector that meets the USB-C specification, and ensure that the device is properly powered and grounded.

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FUSB302BUCX Overview

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