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FUSB302BVMPX - onsemi

Description: Ability to connect as either a host or a device based on what has been attached. ; Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Dead Battery Support (SNK Mode Support when No Power Applied); Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Automatic soft reset packet sent with retries if needed ; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Low Power Operation: ICC = 25 µA (Typical); Automatic

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PCB Footprints
FUSB302BVMPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - FUSB302BVMPX
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3D Models
FUSB302BVMPX - onsemi  - 3D model - Quad Flat No-Lead - FUSB302BVMPX
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FUSB302BVMPX Details

  • Manufacturer Part Number:

    FUSB302BVMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    WQFN-14

  • Package Description:

    MLP-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-11-14

  • Manufacturer:

    onsemi

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302BVMPX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FUSB302BVMPX involves keeping the high-speed USB traces short and away from noise sources, using a solid ground plane, and minimizing vias and layer changes. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation of the FUSB302BVMPX in high-temperature environments, it is essential to provide adequate heat sinking, ensure good airflow, and follow proper thermal design guidelines. The device can operate up to 105°C, but thermal derating may be necessary above 85°C.
  • The FUSB302BVMPX has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during manufacturing and assembly. The device can withstand up to ±8 kV of ESD according to the IEC 61000-4-2 standard.
  • To troubleshoot issues with the FUSB302BVMPX, start by verifying the power supply and clock signals, then check the USB signal integrity using an oscilloscope or protocol analyzer. Ensure that the device is properly configured and that the firmware is up-to-date.
  • Yes, the FUSB302BVMPX can be used in a USB-C application. To do so, you will need to use an external USB-C controller and ensure that the device is configured to support USB-C Alternate Modes (Alt Modes) and Power Delivery (PD).

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FUSB302BVMPX Overview

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