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FUSB302TMPX - onsemi

Description: Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Current Capability Detection as Device; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Current Capability Indication as Host; Low Power Operation: ICC = 25 µA (Typical); Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Audio Adapter Accessory Mode; Default CC open for SRC application.; Automatic retries of sending a packet if a GoodCRC is not received

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Symbol
FUSB302TMPX - onsemi - PCB symbol
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PCB Footprints
FUSB302TMPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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3D Models
FUSB302TMPX - onsemi - 3D model - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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FUSB302TMPX Details

  • Manufacturer Part Number:

    FUSB302TMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-14

  • Package Description:

    MLP-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2017-06-30

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302TMPX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FUSB302TMPX involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the USB traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • The FUSB302TMPX is a highly configurable device. To ensure proper configuration, refer to the onsemi application note AN5223, which provides detailed guidance on configuring the device for various USB applications, including USB-C and Power Delivery.
  • The FUSB302TMPX has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if the device will be operating in a high-temperature environment.
  • For troubleshooting, use a USB protocol analyzer to capture and analyze the USB traffic. Check the device's configuration and settings, and refer to the onsemi application notes and technical support resources for guidance on resolving common issues.
  • Yes, the FUSB302TMPX has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage to the device. Additionally, consider adding external ESD protection devices to the USB lines for added protection.

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FUSB302TMPX Overview

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