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FUSB303BTMX - onsemi

Description: Fully Autonomous USB−C™ Port Controller; Supports Latest Type−C™ Specification Release 1.3; Source, Sink, and DRP Port role Configuration with Optional Accessory Support; GPIO and I2C Configuration; Max 28 V DC Tolerance on ID, VBUS_DET, CC1 and CC2; Dead Battery Support (Sink Port role when No Power Applied); 4 kV HBM ESD Protection for Connector Pins; Try.SRC and Try.SNK modes for Preferring Source Role or Sink Role Respectively; Typical Low Power Operation: ICC < 10µA

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Symbol
FUSB303BTMX - onsemi - PCB symbol
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PCB Footprints
FUSB303BTMX - onsemi PCB footprint - Other - Other - FUSB303BTMX-1
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3D Models
FUSB303BTMX - onsemi - 3D model - Other - FUSB303BTMX-1
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FUSB303BTMX Details

  • Manufacturer Part Number:

    FUSB303BTMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2QFN-12

  • Package Description:

    QFN-12

  • Manufacturer Package Code:

    722AG

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-01-31

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-PQCC-N12

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.06SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.85 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Silver/Gold (Ni/Pd/Ag/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FUSB303BTMX Frequently Asked Questions (FAQs)

  • A good PCB layout for FUSB303BTMX involves keeping the high-speed USB traces short and away from noise sources, using a solid ground plane, and minimizing vias and layer changes. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMC, use a metal shield around the FUSB303BTMX, keep the device away from noise sources, and use a common mode choke or ferrite bead on the USB lines. Also, follow the recommended PCB layout and use a shielded USB cable.
  • The maximum cable length supported by FUSB303BTMX is 3 meters, as per the USB 2.0 specification. However, the actual cable length may vary depending on the cable quality and the system's signal integrity.
  • The FUSB303BTMX has a built-in power management feature that allows it to enter a low-power state when not in use. The device can be powered down by asserting the EN pin low. Additionally, the device has a built-in voltage regulator that can be used to power external circuitry.
  • The FUSB303BTMX has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be operated at a temperature below 85°C. A thermal pad is available on the package to help dissipate heat.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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FUSB303BTMX Overview

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