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FUSB303TMX - onsemi

Description: Fully Autonomous USB−C™ Port Controller; Supports Latest Type−C™ Specification Release 1.3; Source, Sink, and DRP Port role Configuration with Optional Accessory Support; GPIO and I2C Configuration; Max 28 V DC Tolerance on ID, VBUS_DET, CC1 and CC2; Dead Battery Support (Sink Port role when No Power Applied); 4 kV HBM ESD Protection for Connector Pins; Try.SRC and Try.SNK modes for Preferring Source Role or Sink Role Respectively; Typical Low Power Operation: ICC < 10µA

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PCB Footprints
FUSB303TMX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - FUSB303TMX-1
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3D Models
FUSB303TMX - onsemi  - 3D model - Quad Flat No-Lead - FUSB303TMX-1
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FUSB303TMX Details

  • Manufacturer Part Number:

    FUSB303TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X2QFN-12

  • Manufacturer Package Code:

    722AG

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-PQCC-N12

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.85 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Silver/Gold (Ni/Pd/Ag/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FUSB303TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for FUSB303TMX involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the USB connector. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure ESD protection with FUSB303TMX, it is recommended to use a TVS (Transient Voltage Suppressor) diode in parallel with the device, and to follow proper PCB layout guidelines to minimize parasitic inductance and capacitance.
  • The maximum cable length supported by FUSB303TMX is dependent on the specific application and the quality of the cable. However, as a general guideline, a cable length of up to 3 meters is recommended for high-speed USB applications.
  • While FUSB303TMX is primarily designed for USB applications, it can be used in non-USB applications that require high-speed signal switching and ESD protection. However, the device's performance and functionality may vary depending on the specific application.
  • To troubleshoot issues with FUSB303TMX, start by verifying the device's power supply and signal connections. Check for proper PCB layout and routing, and ensure that the device is properly soldered and seated. Use oscilloscopes and logic analyzers to debug signal integrity issues.

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FUSB303TMX Overview

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